DORTMUND, GERMANY (September 14th, 2007) – Innolume, a leading provider of quantum-dot based laser diodes, gain chips and SOAs in the operational range of 1050nm – 1320nm, today announced it has begun sampling the GC-1200/160-200mW, a new generation gain chip providing broad optical gain centered at 1.2µm. The release of the GC-1200/160-200mW represents a further expansion of Innolume’s product lines beyond high power lasers and SOAs.
Optimized for operation in an external cavity setup, the GC-1200/160-200mW has typical values for minimum output power of 200mW over a tuning range of 160nm in a wavelength range otherwise not exploitable with conventional semiconductor light sources. The curved waveguide structure supports very low reflectivity of typically less than 10e-5 for the angled facet. The standard product is delivered in a chip on submount configuration.
"We're pleased with initial customer feedback indicating that this new chip exceeds the performance and quality expectations of module and subsystem providers," said Guido Vogel, Business Development Manager at Innolume, “This chip enables completely new applications in instrumentation, industrial and medical systems which previously could not be produced due to the absence of suitable light sources.”
“Tunable lasers and swept lasers for spectroscopy, metrology and optical coherence tomography benefit from the wide tuning range,” adds Dr. Alexey Kovsh, CTO at Innolume “by applying the proper optics and gratings, the new chip may also be used to create fixed wavelength laser sources with very narrow line-width well suited for direct frequency conversion to visible light used in, for example, laser projection and flow cytometry.”
About Innolume:
Innolume manufactures quantum-dot based opto-electronic components, diode lasers, gain chips, SOAs, SLDs in the operational range of 1.05µm – 1.32µm. We may provide bare dies, chip on carriers as well as fibre-coupled modules. Having all growth, processing, dicing/packaging and testing capabilities in-house, Innolume is able to develop customized solutions efficiently and in a very flexible way, providing various package options from chip-on-submount to integrated fibre-coupled modules.
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