11 July 2025

Successfull implementation of a new fully automated chip-on-carrier (CoC) bonder at Innolume

Innolume, leading semiconductor laser manufacturer, is pleased to announce the successful implementation of a new fully automated chip-on-carrier (CoC) bonder. This strategic upgrade aims to significantly enhance both manufacturing capacity and product quality, reinforcing the company's position as a global leader in laser technology.

The new automated CoC bonder integrates advanced robotics and real-time quality monitoring, allowing for increased throughput while maintaining strict quality standards. We highlight that this move will enable faster delivery times for customers and support the growing demand for high-performance laser components in industries such as telecommunications, medical devices, and industrial manufacturing.

Our commitment to innovation and excellence has driven us to invest further in cutting-edge automation technology. Innolume plans to continue expanding its automation capabilities and innovating to meet the evolving needs of the laser industry. The new equipment is now operational and is expected to deliver immediate benefits in terms of efficiency and product excellence, aiming to meet the highest quality standards and ultimately benefit our customers worldwide.

For any further questions, please contact our team in any convenient way.

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