Innolume at OFC 2026

Innolume will participate in OFC 2026 Exhibition, which will take place from March 17-19, 2026, at the Los Angeles Convention Center, California, USA.

You can visit us at booth #5239, where we will present optical semiconductor solutions for data communication and optical interconnect applications, including:

• 100 GHz Comb Laser designed as a single-chip solution for optical interconnects. The device operates on a 100 GHz grid, supports up to 24 channels with more than 2 THz total bandwidth, and enables transmission at 64 Gb/s NRZ with BER < 10⁻¹².
• 100 mW CW DFB for pluggable optical modules (800G, 1600G, DR8, FR4) with ≥20% power conversion efficiency at 85°C and PCE >24% at 80 mW across the 25-85°C temperature range. The device features RIN < -155 dB/Hz and SMSR >50 dB, ensuring stable high-power operation and reliable performance in high-speed optical transceivers.
• Uncooled high-power DFB lasers delivering more than 250 mW output power with 25% wall-plug efficiency and above 400 mW with an integrated SOA section. The devices feature low RIN < -150 dB/Hz and an ultra-narrow instantaneous linewidth of 2 kHz, making them ideal candidates for ELSFP modules in CPO solutions as well as for the light source for FMCW LiDAR applications

Event Details

Dates: March 17-19, 2026
Location: Los Angeles Convention Center, Los Angeles, CA, USA
Booth: #5239

We look forward to meeting you at OFC 2026.