11 July 2024
Innolume Enhances Production
Innolume continues to optimize their production capabilities and added another automated wire bonder into its production process. The new wire bonder allows for increased precision and consistency, ensuring that each product meets our high-quality standards.
We are confident that this upgrade will greatly enhance our production capabilities and help us continue to deliver outstanding products to our customers.
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Innolume Showcases Its O-Band WDM SOA Portfolio for Next-Generation Optical Networks
Explore how wavelength-specific SOAs for 1260 nm, 1310 nm and 1340 nm enable flexible O-band network design, backed by system-level 100G PAM4 transmission validation.
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Innolume Expands Quantum Dot Manufacturing with New Veeco GEN2000 MBE System
Innolume has placed an order for a new Veeco GEN2000® Molecular Beam Epitaxy (MBE) system to further expand its epitaxial manufacturing platform and support growing demand for gallium arsenide (GaAs)-based quantum dot photonic products for silicon photonics, next-generation optical transceivers, AI infrastructure and cloud data centers.
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Innolume joins the PhotonDelta ecosystem
Innolume joins the PhotonDelta ecosystem, strengthening collaboration within Europe’s integrated photonics industry. The partnership supports innovation in PIC technologies, optical communications, data centers, AI, and next-generation photonic solutions.
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