Innolume Presentation at the EPIC Technology Meeting on Integrated Photonics and Packaging at PHIX

On February 24-25, 2026, the EPIC Technology Meeting on Integrated Photonics and Packaging at PHIX took place in Enschede, the Netherlands. The event focused on photonic integrated circuits (PICs) and packaging technologies used in telecommunications, sensing systems, quantum technologies, and biomedical devices.

During the Application Track: Datacenters and AI, Innolume R&D Engineer Alexey Borodkin gave a presentation titled:

“High Power Laser Integration for Optical Interconnects and Ranging - Approaches and Tradeoffs.”

The presentation covered recent development results related to quantum dot DFB lasers, SOAs, and laser integration. These developments were discussed as an important element for efficient integrated photonic systems. The integration developments are carried out in collaboration with PHIX and Demcon.